Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits

Recent advancements in photonic-electronic integration push towards denser multichannel fiber to silicon photonic chip coupling solutions. However, current packaging schemes based on suitably polished arrays do not provide sufficient scalability. Alternatively, lithographically-patterned fused silica glass interposers have been proposed, allowing for the of fanout waveguides between a dense array on-chip and cleaved ribbon. In this paper, we propose use femtosecond laser inscription fabrication interposer, monolithic V-grooves alignment. The obtained by Femtosecond Laser Direct Writing (FLDW) propagation loss 0.88 dB/cm at 1550 nm. mode-field diameter is 12.8 ± 0.4 μm, 1.24 0.32 dB when standard single mode optical fiber, passively aligned waveguide insertion V-groove created Irradiation followed Chemical Etching (FLICE). average surface roughness etched facet 160 5 Scattering reduced an index-matching adhesive fixation. A out-of-plane mirror angle 41.5° injects light into grating couplers, providing quasi-planar fiber-to-chip package. excess proposed solution limited 2 per interface, including mirror, losses.